ResinDesigns
Tailor-made electronic security solutions, designed for your success.
At Resin Designs, we believe that every challenge is unique. That's why we prioritize a customer-centric approach, working closely with each client to develop customized, high-performance solutions perfectly tailored to their specific needs. As a manufacturer of advanced adhesives and sealants, we specialize in solving complex problems such as printed circuit board protection, medical device assembly, EMI shielding, and thermal management.
From rapid prototyping to mass production, our team delivers fast, flexible solutions that outperform standard materials. Whether you need a custom adhesive, encapsulant, or thermally conductive solution, Resin Designs offers the ideal chemistry for your success.
Advanced thermal management
Choosing an unsuitable thermal interface material (TIM) can lead to uneven heat distribution, air pockets, and low conductivity. Resin Designs' range of thermally conductive polymers effectively disperses heat, preventing hot spots and extending component life. • Liquid Thermal Interface Materials (TIMs): High-flow, self-leveling formulations for optimal heat transfer. • Pre-cured Thermal Pads: Flexible and easy-to-apply solutions for efficient heat dissipation. • Custom Formulations: Optimized for thermal conductivity, viscosity, and mechanical strength to meet the specific needs of each application.
High-performance adhesives
Standard materials don't always meet performance requirements, compromising the protection and reliability of printed circuit boards. Resin Designs offers a comprehensive range of advanced adhesives designed to meet the demands of modern electronics, aerospace, medical, and industrial applications. • Robust and reliable bonding: ensures long-lasting performance under mechanical stress. • Thermal and chemical resistance: withstands extreme temperatures and exposure to harsh chemicals. • Precise application: available in multiple viscosities and with different curing modes to suit diverse manufacturing needs. • Fast and customizable curing: UV, thermal, and room-temperature curing options for efficient production.
Precision-protective encapsulants
Resin Designs encapsulants offer superior protection for delicate electronic components by shielding them from environmental stresses such as humidity, vibration, and temperature variations. • Complete environmental protection: protects against moisture, dust, and chemicals. • Thermal and electrical insulation: ensures stability even under extreme operating conditions. • Flexible or rigid options: designed for varying levels of mechanical flexibility and robustness. • Low shrinkage and stress: prevents damage to sensitive components during the curing process.
Rapid Prototyping & Small Batch Production
Don't let endless delays and rigid product options hold you back when developing new materials for your applications. Resin Designs offers rapid prototyping and small-batch production, allowing you to quickly test custom adhesives, coatings, and encapsulants before committing to large-scale production. Our R&D team provides: • Rapid formulation development tailored to your specific needs • Iterative testing to optimize performance and manufacturability • Scale-up from prototype to series production without compromising efficiency
