MULTICORE HYDX-20 5L FR (MOQ 24)

HYDX-20 allows for efficient soldering of copper, brass, nickel, and mild steel. It does not produce sparks during preheating and soldering. HYDX-20 solder residues are easily washed away, leaving a surface that meets the requirements of the MIL-P-28809A ionic contamination test. The water-soluble HYDX-20 flux is formulated for use on electronic assemblies designed for water cleaning, thus meeting the demand for fluxes whose residues do not need to be removed with CFC-type cleaning solvents. The Hydro-X/20 formulation incorporates several safety features, including the fact that post-soldering residues do not produce excessive foam in the rinse water and can be safely disposed of.

• Highly water-soluble welding residues lead to the use of CFCs
• No penetration of properly polymerized welding resins
• Leaves the boards perfectly clean, without any white residue after washing.
• Absence of welding beads on the dry films